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What are the characteristics of the thermal pad used with PI heating films?
Release time:
2021-01-19
A thermal pad is a high-performance, gap-filling thermal material primarily used as a transfer interface between electronic devices and heat sinks or product housings. It possesses good viscosity, flexibility, excellent compression properties, and thermal conductivity. During use, it completely expels air between electronic components and heat sinks to achieve full contact and improve heat dissipation. So, how much do you know about its characteristics? Let's find out together withPI Heating FilmLet's take a brief look together!
1. Thermal pads exhibit a degree of flexibility, insulation, compressibility, and natural viscosity on their surface. They are specifically manufactured for gap-based heat transfer applications. They can fill gaps and facilitate heat transfer between heating and cooling components. Such products are easily cut, beneficial for automated production and maintenance.
2. They possess thermal conductivity, insulation, and shock-absorbing properties. The material's soft surface has micro-viscosity and is easy to handle. It can be used as a thermal filler between various irregularly shaped parts and heat sinks, housings, etc. Some thermally conductive silicone gels contain glass fibers (or carbon fibers) to enhance mechanical strength.
In summary,PI Heating FilmThis concludes our brief introduction to the characteristics of thermal pads. We hope this has provided some insight. For more information, please follow this website; we will continue to update related articles.
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