Overview of Heat Transfer

Heat dissipation methods:

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A: Conduction  

B: Convection

C: Radiation

Thermal management is a key design challenge in next-generation products across the semiconductor, optoelectronics, consumer electronics, automotive, industrial, medical, and aerospace and defense sectors. The goal of modern electronic product thermal management is to effectively dissipate heat from the interface between the semiconductor and the surrounding environment.

 

Three main stages of heat transfer in electronic products:

Stage 1: Heat transfer within the semiconductor component package

Stage 2: Heat transfer from the package to the heat sink (initial heatsink)

Stage 3: Heat transfer from the heat sink to the ambient environment (final heatsink)

 

Stage 1 is not controllable by system thermal engineers, as the component type determines the internal heat transfer process. In stages 2 and 3, the goal of R&D engineers is to design effective connections from the surface to the initial heat sink and to the surroundings to achieve heat dissipation. This requires not only a comprehensive understanding of the fundamentals of heat transfer, but also knowledge of available interface materials and their important physical properties that affect the heat transfer process.

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