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PI heating film explains the relevant knowledge of thermal conductive pads?
Release time:
2021-01-14
Thermal PadA high-performance thermal material used to fill gaps, primarily for transferring heat between electronic devices and heat sinks or product casings. It possesses good viscosity, flexibility, compression performance, and thermal conductivity. During use, it completely expels air between electronic components and heat sinks, ensuring full contact. Let's learn more with the PI heating film editor!
As electronic devices integrate more powerful functions into smaller components, temperature control has become one of the major design challenges, i.e., how to effectively solve problems when the architecture is continuously shrinking and the operating space is increasingly smaller. Higher unit power generates more heat. Designers have been working to improve the CPU speed and processing power of various servers, requiring microprocessors to continuously improve heat dissipation performance. However, in other application areas requiring higher performance to support high-definition images, such as graphics devices and digital applications, more powerful computing performance is also needed. Therefore, chip manufacturers are more concerned than ever beforeThermal Padand other technologies that can remove excess heat, which can negatively impact component stability and lifespan. It is well known that the operating temperature of a junction has a significant impact on the durability of circuits (transistors), and a small decrease in temperature (10°C-15°C) can double the lifespan of the device. Lower operating temperatures can also reduce signal delay, thus helping to improve processing speed. Additionally, lower temperatures can reduce the idle power consumption (dissipated power) of the device, thereby reducing overall power consumption and heat dissipation.
From an engineering perspective, thermal pads are designed to match irregular material surfaces, utilizing high-performance thermal materials and eliminating air gaps to improve overall heat transfer capabilities, enabling devices to operate at lower temperatures.
The above is the PI heating film editor's explanationThermal Padof the relevant knowledge.
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