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Thermal conductive materials are a new type of industrial material. These materials are designed to meet the thermal conductivity requirements of equipment in recent years, and they possess high performance and reliability. They are suitable for various environments and requirements, and appropriate measures have been taken for potential heat conduction problems, providing strong support for the high integration, miniaturization, and thinning of equipment. Thermal conductive products have been increasingly used in many products, improving product reliability.
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2021/02
How to use a thermal pad with a PI heating film?
When picking up a heat-conducting pad, larger pads should be grasped from their center. There are no specific requirements for grasping smaller sheets, as large pads are susceptible to uneven stress, which can cause deformation, affect subsequent operations, and even damage them.
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2021/01
What are the characteristics of the thermal pad used with PI heating films?
A thermal pad is a high-performance gap-filling thermal material, mainly used as a transfer interface between electronic devices and heat sinks or product housings. It has good viscosity, flexibility, good compression performance, and thermal conductivity. During use, it can completely exhaust the air between the electronic components and the heat sink to achieve full contact and improve the heat dissipation effect.
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2021/01
The thermal pad boasts excellent thermal conductivity and high dielectric strength. It serves as an alternative to thermal grease. The material itself possesses a degree of flexibility. It is well-suited for use between power devices and aluminum heat sinks or casings to achieve effective heat conduction and dissipation.
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2021/01
PI heating film explains the relevant knowledge of thermal conductive pads?
A thermal pad is a high-performance gap-filling thermal material primarily used as a transfer interface between electronic devices and heat sinks or product casings. It features good viscosity, flexibility, excellent compression properties, and thermal conductivity. During use, it completely removes air between the electronic components and heat sink to achieve full contact.
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2021/01